Vacuum Transfer System
Category：
Vacuum Transfer System
Keywords：
Vacuum Transfer System
Details Introduction
Yuan Lei independently designed and built the T9 platform, an industrial general-purpose 12-inch wafer automatic transfer cluster. With a cleanliness level reaching ISO class 1, it meets the needs of advanced process technology, completely replacing similar foreign products. Multi-layer precision coating is achieved in one molding process, thereby improving the efficiency and batch-to-batch repeatability of the customer's required coating reaction.
|
Serial Number |
Content |
Parameters |
|
1 |
Wafer Size |
300mm |
|
2 |
Maximum Temperature |
380℃ |
|
3 |
Pre-vacuum Chamber |
50pc×2 |
|
4 |
Maximum Number of PMs |
6 |
|
5 |
Cleanliness Level |
ISO class 1 |
|
6 |
PWP Index (Metal Contamination) |
0.05@0.037um/( |
|
7 |
Aligner |
Wafer aligner and AWC configured |
|
8 |
Wafer breakage rate |
< =1/100000 |
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Contact Us
Tongling source and semiconductor technology co ltd
Telephone:
Mailbox:zhaolei@aname-nj.com(Manager Zhao)
Address:Electronic Information of Xincheng Office Street West Park, Tongguan District, Tongling City, Anhui Province
Industrial Park Standardization Workshop Building 2